As AI workload demands continue to accelerate, Cloud Service Providers, System OEMs, and IP/Silicon vendors require a scalable, high-performance solution to support advanced workloads. By enhancing performance, optimizing power and cost efficiency, and promoting interoperability and supply chain diversity, the UALink 200G 1.0 Specification delivers a low-latency, high-bandwidth interconnect designed for efficient communication between accelerators and switches within AI computing pods.
Location: Room 201
Duration: 40 minutes
Sponsor(s):
UALink Consortium
Session Type:
Workshop